Multi-Wire Cutting Machine for Glass Wafer, Ceramic Wafer, Magnetic Wafer, Gemstone Wafer

FOB Price: US $60,000-300,000 / Set
Min. Order: 1 Set
Min. Order FOB Price
1 Set US $60,000-300,000/ Set
Port: Tianjin, China
Production Capacity: 600 PCS Per Year
Payment Terms: L/C, T/T
Multi-Wire Cutting Machine for Glass Wafer, Ceramic Wafer, Magnetic Wafer, Gemstone Wafer

Basic Info

Product Description

  • Model NO.: CG500
  • Certification: CE, ISO
  • Control System: Industrial Computer
  • Glass Edging Machine Type: No
  • Condition: New
  • Cut Material 2: Quartz Crystal
  • Cut Material 4: Raremetal and Alloy Block
  • Cut Material 6: Glass
  • Cut Material 8: Other Hardness
  • Feature: High Precision, High Efficient
  • Transport Package: Waterproof Plastic Cloth+Wooden Box`
  • Origin: China
  • Type: Glass Cutting Machine
  • Structure: Horizontal
  • Glass Washing Machine Type: No
  • Grinding Head Number: No
  • Cut Material 1: Sapphire
  • Cut Material 3: Semiconductor Material
  • Cut Material 5: Ceramic
  • Cut Material 7: Magnetic
  • Warranty: 1 Year
  • Trademark: SINOPOLY
  • Specification: 3000x1490x2630mm
  • HS Code: 84649011

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Ms. Shirly Chen

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