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Beijing Sinopoly Technology Co., Ltd.

Cutting Saw Machine, Saw Machine, Cutting Saw manufacturer / supplier in China, offering Multiwire Saw, Ex Factory China, to Slice Hardness Wafer, Much More Higher Efficient Than Laser Cutting Machine, Automatic Hot Stamping Machine Die Cutter Die Cutting Machine, Die Cutting and Creasing Machine and so on.

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Supplier Homepage Product Multi-wire Saw Machine Multiwire Saw, Ex Factory China, to Slice Hardness Wafer, Much More Higher Efficient Than Laser Cutting Machine

Multiwire Saw, Ex Factory China, to Slice Hardness Wafer, Much More Higher Efficient Than Laser Cutting Machine

FOB Price: US $60,000-300,000 / Set
Min. Order: 1 Set
Min. Order FOB Price
1 Set US $60,000-300,000/ Set
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Port: Tianjin, China
Production Capacity: 600 PCS Per Year
Payment Terms: L/C, T/T

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Basic Info
  • Model NO.: CG600
  • Type: Wire Saw
  • Cutting Object 2: Crystal Bars
  • Cutting Object 4: Special Ceramic
  • Cutting Object 6: Silicon Ingots
  • Cutting Object 8: Rare Metals
  • Cutting Object 10: Other Hard and Crisp Materials
  • Transport Package: Waterproof Plastic Cloth+Wooden Box`
  • Origin: China
  • Application: Silicon
  • Cutting Object 1: Sapphire Ingots
  • Cutting Object 3: Magnetic Blocks
  • Cutting Object 5: Titannium Alloys
  • Cutting Object 7: Semiconductor
  • Cutting Object 9: Alloys
  • Trademark: SINOPOLY
  • Specification: 3000x1490x2630 mm
  • HS Code: 84649011
Product Description
600 multi-wire cutting machine
 
Multi-wire cutting machine is a new concept type of equipment, the working theory of this machine is to bring the grounding materials to the workpiece processing area and ground, in this process, the steel wire form a wire net on the main wire roller by the guiding of dozens of guider roller, the workpiece complete the feeding by means of the lifting of work bench, and cutting the workpiece into hundreds of thin pieces, this is a new cutting method.

CG Serial multi-wire cutting machine is high speed medium size machine, of which is 3 types: CG400,CG500,CG600, and they are suitable for magnetic material and crystals, have the advantage of the high cutting efficiency, high production rates, high stability.
 
Product features:

Suitable for the cutting of magnetic material and crystals, CG500C multi-wire cutting machine is also used for the turn direction cutting long plates, the most thin piece thickness is 5mm, and have the advantage of the high cutting efficiency, high production rates, and high reliability.

Core parts are the first grade brand products that imported from Japan, Europe and etc., long period operating, precise and stable.

The main technique data reaches and even exceed overseas same types machine standard, can satisfy different cutting technique requirements.

High cutting speed, high cutting accuracy, high cutting efficiency, can save materials, labor and power.

Smart controlled, operate easily, and work reliably.
 
 
Technique data:
Wire Saw ModelLKCG600
Processing Capacity
Max Work Space485×420×135mm
Equipment Size and Weight
Machine Dimensions3000×1490×2630mm
 Machine Weight4000Kg
Roller
Outside Diameter ×Sloth Widthφ140±10×485mm
Spindle Pitch 595mm
Wire
Wire Diameter φ0.10 ~ φ0.2mm
 
Spool Wire Storing Quantity
20Kg
Round Wire Speed1000m/min
Workbench
work Stage Up-and-Down Stroke 150mm
Cutting Feed Speed0.1~999.9mm/hour
Fast Feed Speed150mm/min
Sand Fluid
SandGC#600~GC#6000
Maximum Capacity of Sand Barrel110L
Machine Noise 300L/min
Motor and Cooling Machine Power
Roller Spindle Drive Motor11KW(AC Servo Motor)
Wire Feed Motor5.5KW×2 (AC Servo Motor)
Workbench Lifting Motor400W (AC Servo Motor)
Wire Tensioning Motor3KW×2 (AC Servo Motor)
Sand Pump Motor1.5KW
Wire Take-up, Pay-off and Traversing Motor 200W×2 (AC Servo Motor)
Mixing Motor 400W
Coolers Motor7KW
Power Supply and Air Supply Requirements
PowerThree-phase 380V 50Hz
Full-load Power30 KVA
Air Consumption 600L/min
* The technical data will change if we amend or improve it.
Multiwire Saw, Ex Factory China, to Slice Hardness Wafer, Much More Higher Efficient Than Laser Cutting Machine
Multiwire Saw, Ex Factory China, to Slice Hardness Wafer, Much More Higher Efficient Than Laser Cutting Machine
Multiwire Saw, Ex Factory China, to Slice Hardness Wafer, Much More Higher Efficient Than Laser Cutting Machine
Multiwire Saw, Ex Factory China, to Slice Hardness Wafer, Much More Higher Efficient Than Laser Cutting Machine
Multiwire Saw, Ex Factory China, to Slice Hardness Wafer, Much More Higher Efficient Than Laser Cutting Machine
Multiwire Saw, Ex Factory China, to Slice Hardness Wafer, Much More Higher Efficient Than Laser Cutting Machine

 
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Ms. Shirly Chen
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