Auto Diamond Multi Wire Saw Precision Cutting Machine to Slice Glass Wafer and Ceramic Wafer

FOB Price: US $95,000-300,000 / Set
Min. Order: 1 Set
Min. Order FOB Price
1 Set US $95,000-300,000/ Set
Port: Tianjin, China
Production Capacity: 600 PCS Per Year
Payment Terms: L/C, T/T
Auto Diamond Multi Wire Saw Precision Cutting Machine to Slice Glass Wafer and Ceramic Wafer

Basic Info

Product Description

  • Model NO.: DX2231HRC
  • Certification: CE, ISO
  • Control System: Industrial Computer
  • Glass Edging Machine Type: No
  • Condition: New
  • to Cut 2: Crystal Bar
  • to Cut 4: Special Ceramic
  • to Cut 6: Gemstone, Sapphire
  • to Cut 8: Magnetic Block
  • Feature 1: High Precision, High Efficient
  • Transport Package: Waterproof Plastic Cloth+Wooden Box`
  • Origin: China
  • Type: Glass Cutting Machine
  • Structure: Horizontal
  • Glass Washing Machine Type: No
  • Grinding Head Number: No
  • to Cut 1: Sapphire Ingot
  • to Cut 3: Optical Glass
  • to Cut 5: Semiconductor Block
  • to Cut 7: Rare Metal and Alloy Block
  • Warranty: 1 Year
  • Trademark: SINOPOLY
  • Specification: 2000x1630x2530mm
  • HS Code: 84649011

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Ms. Shirly Chen

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