Cutting Machine Slicing Silicon Wafers for Solar Energy Cell panel
|FOB Price:||US $95,000-300,000 / Set|
|Min. Order:||1 Set|
|Min. Order||FOB Price|
|1 Set||US $95,000-300,000/ Set|
|Production Capacity:||600 PCS Per Year|
|Payment Terms:||L/C, T/T|
- Model NO.: YBDX160S
- Type: Diamond Multi Wires
- Application 2: Crystal Bar Precision Cutting
- Application 4: Rare Metal Precision Cutting
- Application 6: Special Ceramic Precision Cutting
- Application 8: Silicon Chip Precision Cutting
- Application 10: Sic Wafers Precision Cutting
- Transport Package: Waterproof Plastic Cloth+Wooden Box`
- Origin: China
- Application: Crystal
- Application 1: Sapphire Ingot Precision Cutting
- Application 3: Semiconductor Precision Cutting
- Application 5: Alloy Precision Cutting
- Application 7: Optical Glass Precision Cutting
- Application 9: Magnetic Materials Precision Cutting
- Trademark: SINOPOLY
- Specification: 1982*2730*2666mm
- HS Code: 84649011
Model No. YBDX160S
Name: Automatic Diamond Multi Wire Saw Cutting Machine
1. Highlighted product, new designed
2. Working objects: sapphire pillar, blue gem bar, special optical glass, crystal pillar
3. Special application: to cut sapphire pillar, blue gem bar (<=Φ160mm) into pieces
4. Other general application: to cut for LED substrate slice, watch glass, mobile phone LCD etc.
5. Cutting tool: diamond multi-wires (high efficiency)
6. Core parts self-designed
7. With Siemens servo motor
8. High precision, high speed, high efficiency
9. Good surface finishing on the flat sheets
|Name||Automatic Diamond Multi Wire Saw Cutting Machine|
|1||Max work space||(MaxΦ160) X 300 mm|
|2||Grooved wheel diameter||Φ200 X 320 mm X Two rollers|
|3||Work bench trip||220 mm|
|4||Cutting speed||0.1-999.9 mm/h|
|5||Wire Running speed||0-1500m/min|
|6||Cutting wire diameter||Φ0.13-Φ0.3mm|
|7||Store wire qty||50000m(Φ0.25mm diamond wire)|
|8||Compressed air consumption||<=500L/min|
|9||Power||Three phase four line AC380V/50HZ|
|10||Boundary size(L*h*w)||3500*2100*2560 mm|
YBDX160 automatic diamond multi-wire saw cutting machine is mainly to meet the sapphire production and processing enterprises sapphire bar for sheet cutting needs.
1. The device has a precision temperature control system, high-precision slicing, warping small, stable slice quality, low cost cutting.
2. With swing cutting function, suitable for sapphire and other high-hard brittle materials processing. Equipment is simple, easy maintenance.
3. The device uses the load sensor to measure the supply line and take-up side tension; tension control using closed-loop feedback control to ensure that the cutting process of cutting line tension constant.
4. With disconnection monitoring, alarm and host automatic emergency stop, coolant temperature monitoring and automatic alarm function.
5. The device can set the maximum line speed, acceleration / deceleration alignment time, reciprocating cycle, swing angle and speed, table moving speed and other process parameters, process adjustment convenient.
6. The device can display the cutting line length, set the coolant temperature, display the cutting time and cutting the remaining time, display the remaining length, showing the current cutting and winding process.
7. With tension early warning function, effectively avoid abnormal tension fluctuations caused by disconnection failure.
8. Inverted cutting, chip residue and debris falling directly into the receiving box, effectively avoiding the risk of disconnection.
9. The use of water-soluble cutting fluid, easy to clean, green.
10. With power off delay shutdown.