Diamond Wire Saw (crystal sapphire silicon wafer magnet cutting machine)

Model: DX3231H
The machine is the latest product of our company, the features is adding the cutting size, and make the operation more reasonable, and technique structure more terse, and can adapt the meets of the markets more capably. It is suitable for 0.1-6mm straight plate, including the magnetic material and optical material, rare metals material and half conductive material.
 Technical featuresThe machine is the high speed medium-sized type among our company's multi-wire cutting machines, mainly for processing various hard crisp materials into the less then 6mm thickness plates, the invention of this machine can be suitable for clients' higher requirements on the processing efficiency, working stability, technique application and economics.

This machine type can achieve the obvious processing efficiency at the precondition of the high accuracy and high reliability assurance. The basic mechanical parts such as main parts, bearing, and linear guide way, ball screw and driving belt of the electric controlling system are all imported brand products.

The principal axis key parts is made by super and professional steel and processed by multi heat processing, machine processing and surface processing.

The frame of the machine is made by of the superior casting, and have made multiple times aging treatment during the course of processing, it's shaped by precision processing center lathe.

The whole machine control the process like the releasing wire, rewinding, winding, tension, axis, feeding by adopting  9-axis servo system of feed line.

The mature and complete smart controlling system is integrated with the perfect technique system that is accumulated for over dozens of years. The accuracy stability, application reliability and steel wire speed have reached the highest level at the  same type machines of the domestic and overseas, meanwhile this machine have wide application on technique.Technical data
Cutting trial parameter